January 14, 2020 by Market-NewsFlash
Global Chip on Flex Market, By Type (Single Sided Chip On Flex, Others), By Application (Static, Dynamic), By Verticals (Military, Medical, Aerospace, Electronics) - Forecast 2021
Chip On Flex Market is expected to grow at CAGR of ~4.43% during the forecast period and expected to reach market size of US ~$1795 Million by the end of forecast period. Chip On Flex is also known as direct chip attachment. Chip On Flex possess high bending strength, which makes it useful in processes that require bending and folding. It is also used in electronic equipment which requires repeated movements such as printers.
The other advantages provided by Chip On Flex technology include savings in space, mechanical flexibility, low production cost and increased reliability from heat distribution. The market is majorly driven by growing range of applications in the industrial, military, computer, telecommunication, consumer electronics, and medical electronics industries. The increasing collaboration between printed circuit board companies and funding by government bodies also ensures the prevalence of flexible printed circuit board in consumer electronics, automotive, aerospace, defense, Medical as well as other applications.
Unlike rigid boards, flex circuits are not restricted to two dimensions. Because they are as flexible as wires or ribbon cables, flex circuit design options are endless. Flex circuits can be designed to meet highly complex and unimaginable configurations while being able to operate in the most hostile environments. Flexible Circuits are third dimension and can interconnect between two or more planes during execution. With the increasing footprints of wearable’s in the medical device space the two dimensional circuits are getting replaced by the flexible circuit boards acts as an opportunity for the growth of flexible printed boards during the forecasted period.
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Chip on Flex Market is expected to grow from USD 1437 Million in 2016 to USD 1795 Million by 2021,…Read on marketresearchfuture.com
Chip On Flex Market
The Global Chip On Flex Market has been segmented on the basis of types, applications and verticals. The types of Chip On Flex are one sided Chip On Flex and others. The applications comprises of static and dynamic flexing. The various verticals of Chip On Flex market are military, medical, aerospace, electronics and others.
The prominent players in the Chip On Flex market are- LGIT corporation (U.S.), Stemko Group (Korea), Flexceed (Japan), Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond Technology Co. Ltd.(China), AKM Industrial Company Ltd.(China), Compass Technology Company Limited (Hong Kong), Compunetics Inc. (U.S.) and Stars Microelectronics Company Ltd (Thailand) and among others.
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